Shiseido Clé de Peau Beauté Moose Netwiant An Cleansing Foam
About the product
Product description
Shiseido Clé de Peau Beauté Mousse Nettoyante An features a soft and pleasant texture, with its micro-bubbles penetrating deep into the pores to remove daily impurities, excess sebum, and makeup residue.
Key Benefits:
This cleansing mousse provides:
- A lasting feeling of freshness
- Deep oxygenation of skin cells
- Effective toning
The inclusion of hyaluronic acid helps maintain skin elasticity and prevents moisture loss. As a result, the complexion improves, leaving the skin soft, even, elastic, and delicate.
Perfect for Sensitive Skin:
The mousse is designed for cleansing irritated, inflamed, or damaged skin. Its gentle action also counters the effects of UV radiation, making it ideal for the summer season. After use, the skin becomes velvet-like, deeply hydrated, refreshed, and rejuvenated. It also helps normalize the activity of sebaceous glands.
Characteristics
| Weight | 140 g |
|---|---|
| Product series | Cle De Peau |
| Type | Foam |
| Purpose/Concern | CleansingEven skin toneAll skin typesMoisturization |
| Application Area | Face |
| Gender | Women |
| manufacturer | Shiseido |
Composition and method of application
Ingredients: Water, Glycerin, Stearic Acid, Sorbitol, Myristic Acid, PEG-6, PEG-32, Potassium Hydroxide, Lauric Acid, PEG-20 Glyceryl Isostearate, Sodium Methyl Cocoyl Taurine, Lauryl Betaine, Glyceryl Stearate (SE), Beeswax, Polyquaternium-39, PEG / PPG-14/7 Dimethyl Ether, Trehalose, PEG-90M, PEG / PPG-36/41 Dimethyl Ether, Sodium Polyacrylate, Raspberry Extract, Diamond Powder, Serine, Glycine, White Mushroom Polysaccharide, Acetylated Sodium Hyaluronate, Sodium Hyaluronate, Angelica Root Extract, Hydrolyzed Silk, Hydrolyzed Conchiolin, Perilla Leaf Extract, Tocopherol, Silicon Dioxide, EDTA-2Na, BG, theanine, sodium metabisulfite, BHT, sodium benzoate, fragrance, iron oxide.
How to use: mix a 1 cm drop of mousse with water, lather and spread lightly over the face, then rinse with warm water.